{"id":189,"date":"2017-12-20T08:00:05","date_gmt":"2017-12-20T16:00:05","guid":{"rendered":"https:\/\/www.ece.ucsb.edu\/ipl\/?p=189"},"modified":"2017-12-29T02:28:24","modified_gmt":"2017-12-29T10:28:24","slug":"3d-integrated-silicon-photonics","status":"publish","type":"post","link":"https:\/\/web.ece.ucsb.edu\/ipl\/2017\/12\/3d-integrated-silicon-photonics\/","title":{"rendered":"3D Hybrid Integrated Silicon Photonics"},"content":{"rendered":"<p>[vc_row][vc_column][vc_column_text]We have developed a novel integration platform that conveniently merges InP and GaAs devices with SiPh in a backend processing step. Light is coupled between layers using grating couplers and total internal reflection (TIR) turning mirrors. This integration platform enables laser integration for silicon photonics and multi-chip photonic interposers. An important feature is superior heat dissipation that yields a 3X improvement in thermal impedance compared to other approaches. In addition to being featured in the <a href=\"https:\/\/www.osa-opn.org\/home\/articles\/volume_27\/december_2016\/extras\/3-d_hybrid_laser_integration_for_silicon_photonics\/\" target=\"_blank\" rel=\"noopener\">OSA Optics and Photonics News<\/a> magazine, this work was twice selected as a finalist for the Tingye Li Innovation Prize and was recognized with a <a href=\"http:\/\/www.ece.ucsb.edu\/news\/?i=7338\" target=\"_blank\" rel=\"noopener\">best paper award at the 2017 Asia Communications and Photonics Conference<\/a>.<\/p>\n<p><b><img loading=\"lazy\" class=\"size-medium wp-image-296 alignnone\" src=\"https:\/\/www.ece.ucsb.edu\/ipl\/wp-content\/uploads\/3d_integration-300x150.jpg\" alt=\"\" width=\"300\" height=\"150\" \/> \u00a0 \u00a0<img loading=\"lazy\" class=\"wp-image-294 alignnone\" src=\"https:\/\/www.ece.ucsb.edu\/ipl\/wp-content\/uploads\/wafer-300x182.jpg\" alt=\"\" width=\"262\" height=\"159\" srcset=\"https:\/\/web.ece.ucsb.edu\/ipl\/wp-content\/uploads\/wafer-300x182.jpg 300w, https:\/\/web.ece.ucsb.edu\/ipl\/wp-content\/uploads\/wafer.jpg 550w\" sizes=\"(max-width: 262px) 100vw, 262px\" \/> \u00a0 \u00a0<img loading=\"lazy\" class=\"wp-image-303 alignnone\" src=\"https:\/\/www.ece.ucsb.edu\/ipl\/wp-content\/uploads\/16-e1514364990985-300x300.jpg\" alt=\"\" width=\"152\" height=\"152\" srcset=\"https:\/\/web.ece.ucsb.edu\/ipl\/wp-content\/uploads\/16-e1514364990985-300x300.jpg 300w, https:\/\/web.ece.ucsb.edu\/ipl\/wp-content\/uploads\/16-e1514364990985-150x150.jpg 150w, https:\/\/web.ece.ucsb.edu\/ipl\/wp-content\/uploads\/16-e1514364990985.jpg 1000w\" sizes=\"(max-width: 152px) 100vw, 152px\" \/><br \/>\n<\/b><\/p>\n<p><b>Selected Relevant Publications:<\/b><\/p>\n<ol>\n<li>\u201c3D Integrated Hybrid Silicon Laser,\u201d <a href=\"https:\/\/www.osapublishing.org\/oe\/abstract.cfm?uri=oe-24-10-10435\" target=\"_blank\" rel=\"noopener\">Optics Express, vol. 24, no. 10, pp. 10435-10444, 2016<\/a>.<\/li>\n<li>&#8220;High-Thermal-Performance 3D Hybrid Silicon Lasers,&#8221; <a href=\"http:\/\/ieeexplore.ieee.org\/abstract\/document\/7924369\/\" target=\"_blank\" rel=\"noopener\">Photonics Technology Letters, vol. 28, no. 14, pp. 1143-1146, 2017<\/a>.<\/li>\n<li>&#8220;Tunable 3D Integrated Hybrid Silicon Laser,&#8221; <a href=\"https:\/\/www.osapublishing.org\/abstract.cfm?uri=ACPC-2017-Su3L.3\" target=\"_blank\" rel=\"noopener\">Asia Communications and Photonics Conference (ACP), paper Su3L.3, 2017<\/a>.<\/li>\n<li>\u201cTunable 3D hybrid integrated silicon photonic external cavity laser,\u201d <a href=\"https:\/\/www.osapublishing.org\/abstract.cfm?uri=IPRSN-2016-ITu3B.3\" target=\"_blank\" rel=\"noopener\">Integrated Photonics Research, Silicon and Nanophotonics Conference (IPR), paper ITu3B.3, 2016<\/a>.<\/li>\n<li>\u201cThermal Performance of 3D Integrated Silicon Laser,\u201d <a href=\"http:\/\/ieeexplore.ieee.org\/abstract\/document\/8082915\/\" target=\"_blank\" rel=\"noopener\">Conference on Lasers and Electro-Optics (CLEO), 2017<\/a>.<\/li>\n<li>\u201c3D Integrated Silicon Photonic External Cavity Laser,\u201d <a href=\"https:\/\/www.osapublishing.org\/abstract.cfm?uri=CLEO_SI-2016-SM4G.5\" target=\"_blank\" rel=\"noopener\">Conference on Lasers and Electro-Optics (CLEO), paper SM4G.5, 2016<\/a>.<\/li>\n<li>\u201c3D Integrated Hybrid Silicon Laser,\u201d <a href=\"http:\/\/ieeexplore.ieee.org\/xpls\/abs_all.jsp?arnumber=7341989\" target=\"_blank\" rel=\"noopener\">European Conference on Optical Communication (ECOC), paper We2.5.5, 2015<\/a>.<\/li>\n<li>\u201c3D Integrated Silicon Photonic External Cavity Laser (SPECL),\u201d <a href=\"http:\/\/ieeexplore.ieee.org\/xpls\/abs_all.jsp?arnumber=6995384\" target=\"_blank\" rel=\"noopener\">IEEE Photonics Conference, paper Tue3.2, 2014<\/a>.<\/li>\n<\/ol>\n<p><em><b>Collaborators:<\/b> McGill Institute for Advanced Materials, BinOptics<br \/>\n<\/em>[\/vc_column_text][\/vc_column][\/vc_row]<\/p>\n","protected":false},"excerpt":{"rendered":"<p>[vc_row][vc_column][vc_column_text]We have developed a novel integration platform that conveniently merges InP and GaAs devices with SiPh in a backend processing step. Light is coupled between layers using grating couplers and total internal reflection (TIR) turning mirrors. This integration platform enables laser integration for silicon photonics and multi-chip photonic interposers. An important feature is superior heat&hellip;<\/p>\n","protected":false},"author":1,"featured_media":302,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[9],"tags":[],"_links":{"self":[{"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/posts\/189"}],"collection":[{"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/comments?post=189"}],"version-history":[{"count":6,"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/posts\/189\/revisions"}],"predecessor-version":[{"id":511,"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/posts\/189\/revisions\/511"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/media\/302"}],"wp:attachment":[{"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/media?parent=189"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/categories?post=189"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/web.ece.ucsb.edu\/ipl\/wp-json\/wp\/v2\/tags?post=189"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}