File:Liftoff Results.zip
The test wafers with metal dep from yesterday ( 0.9 and 1.8 um resist) lifting off this morning with a pipet. Tey were soaked overnight in Acetone and no U/S. Still areas of large flaps but good enough to proceed with the dummy chip.
The 0.9 um resist looked better but subjective.
The Dummy chip done this morning also looks okay but there are fences/flaps. I did 10min with high power and 7/7 intens/freq in acetone. I don't see any signs of shorting so I will proceed with the Chips 3 and 4 tomorrow.
I used SPR0.9 resist with CEM at 0.6 sec exposure. I don't know if we need the CEM though. I could try one with and without to see if there is a liftoff difference.
I coated Chips 3 and 4 but I'm reworking due to particles and fibers on both. Chip 3 also has coating issues, see images.
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| Date/Time | Dimensions | User | Comment | |
|---|---|---|---|---|
| current | 12:39, 22 August 2012 | (3.26 MB) | Jaredhulme (Talk | contribs) | The test wafers with metal dep from yesterday ( 0.9 and 1.8 um resist) lifting off this morning with a pipet. Tey were soaked overnight in Acetone and no U/S. Still areas of large flaps but good enough to proceed with the dummy chip. The 0.9 um resist l |
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