Revision history of "File:Liftoff Results.zip"

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  • (cur | prev) 12:39, 22 August 2012Jaredhulme (Talk | contribs). . (795 bytes) (+795). . (The test wafers with metal dep from yesterday ( 0.9 and 1.8 um resist) lifting off this morning with a pipet. Tey were soaked overnight in Acetone and no U/S. Still areas of large flaps but good enough to proceed with the dummy chip. The 0.9 um resist l)