University of California, Santa Barbara
Department of Electrical and Computer Engineering

Semiconductor Device Processing

ECE 220A / MAT 215A - Fall 2004

Instructor: Dr. Ilan Ben-Yaacov

Schedule:Tues/Thurs 12:00 - 1:50 p.m., PHELP 1437

Syllabus

(Download printable pdf version of syllabus)

Topics to be covered

    • Thermal Oxidation

    Junction Formation

            Diffusion

            Ion implantation

    Optical Lithography

    Etching

            Wet Etching

            Reactive Ion Etching

    Thin Film Deposition

            Evaporation

            Sputtering

            Chemical Vapor Deposition

    Ohmic, Schottky, and MOS Contact Formation

    NMOS Process and Characterization

Prerequisite:  Basic understanding of semiconductor materials or consent of the instructor

Instructor:  Ilan Ben-Yaacov, Room 2213, ESB, ext. 5295, ilan@engineering.ucsb.edu

Time:  Tuesday and Thursday 12:00-1:50 p.m.

Place:  PHELPS 1437

Text:  Silicon Processing for the VLSI Era: Volume 1 - Process Technology by S. Wolf and R. N. Tauber, published by Lattice Press, 2000.

Handouts and class notes will complement the text.  All handouts can be downloaded by clicking on the appropriate link at the bottom of this website.

Course format:  There will be homework assignments, a midterm, laboratory work, and a final lab project. Laboratory work will consist of experimenting with various processes such as lithography, thermal oxidation, and wet etching, and determining process tolerances.  For the final project, you will use the skills you have developed in the lab to fabricate and characterize a MOS transistor.  Homework, midterm, lab, and final lab project will each contribute 25%, 25%, 10% and 40% to the final grade.

Office Hours:  Office hours are Tuesdays and Thursdays 2:30-3:30 p.m. or by appointment.

Laboratory Hours:  There are no scheduled hours for the lab work.  The teaching cleanroom will be available at most times with key card access, if two or more students are working together.  For safety reasons, you will not be permitted to work alone.  There will be equipment demonstration sessions, which are required.

Lab Safety:  It is essential that safety procedures be followed at all times.  You will be working with acids (including HF), bases, and organic solvents that can be hazardous if not handled properly.  You are required to attend a safety orientation session before you will be permitted to enter the lab.  There are sessions provided by the university, or a series of tapes provided by the ECE department and Martin Vandenbroeck.

Teaching Assistants: The TA's are Danny Feezell (feezell@engineering.ucsb.edu, lab hours Mon/Wed 9-10:30am) and Chris Sarantos (csarantos@engineering.ucsb.edu, lab hours Wednesday 1-2:30pm)

Lab Supervisor: Martin Vandenbroeck, Room 4110, Engineering I, ext. 4142, mav@ece.ucsb.edu

 

Lab Projects

Lab Project 1 - Due Thurs, 10/7/04 by 5:00pm

Lab Project 2 - Due Thurs, 10/21/04 by 5:00pm

Final Lab Project - Due Tues, 12/7/04 by 5:00pm

 

Homeworks

Homework 1 - Due 10/5                    HW 1 Solutions

Homework 2 - Due 10/12                  HW 2 Solutions

Homework 3 - Due 10/26                  HW 3 Solutions

Homework 4 - Due 11/9                    HW 4 Solutions

Homework 5 - Due 11/18                  HW 5 Solutions

 

Midterm

The midterm will be held on Tuesday, November 23rd.  You will be allowed 1 page (8.5 x 11 inch) of notes, you may write on the front and back, and a calculator.

 

Handouts 

NMOS Process                              Phosphorous Predeposition

Wafer Scribing and Cleaning           Metal Lift-Off Process

Oxidation Procedure                       Metal Evaporation

Lithography Process                        Sintering Procedure

HF Safety Tips                                Strip Annealing

Furnace Cleaning                             Periodic Table of Elements

 

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This page was last updated on 12/17/04.