Difference between revisions of "Date"
From OptoelectronicsWiki
(Adding Process issues by Date) |
(→Process Issues and Defects) |
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|+ '''Hybrid Silicon Process''' | |+ '''Hybrid Silicon Process''' | ||
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| − | ! Date!! Issue or Defect !! Link | + | ! Date!! Issue or Defect !! Link |
| + | |||
| + | |- | ||
| + | | [[Jun 08/2012]] || Sweeper Summary|| || | ||
| + | |- | ||
| + | | [[Arp 13/2012]] || HF etching protection, Mesa Litho stripping || || | ||
| + | |- | ||
| + | | [[Mar 16/2012]] || HF etching protection, Mesa Litho stripping || || | ||
|- | |- | ||
| − | | [[ | + | | [[Mar 01/2012]] || Bonding, Resist coverage, HF wicking, Patterns under EPI || || |
| + | |- | ||
| + | | [[Feb 29/2012]] || Bonding || || | ||
|- | |- | ||
Latest revision as of 11:25, 8 June 2012
Process Issues and Defects[edit]
| Date | Issue or Defect | Link | |
|---|---|---|---|
| Jun 08/2012 | Sweeper Summary | ||
| Arp 13/2012 | HF etching protection, Mesa Litho stripping | ||
| Mar 16/2012 | HF etching protection, Mesa Litho stripping | ||
| Mar 01/2012 | Bonding, Resist coverage, HF wicking, Patterns under EPI | ||
| Feb 29/2012 | Bonding |
