Difference between revisions of "Cleanroom Equipment"

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* Remarks, results, optimization runs
 
* Remarks, results, optimization runs
  
== Ebeam4 ==
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== Tools ==
* Very smooth sidewall profile
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* Great sidewall coverage if two directional rotation is used
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* Tool notes
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** Pumping down around 1 hr
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** Use group source
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* Check [[media:100520_Ebeam4 Probe Metal Deposition.ppt|Deposit Report]] for images using two different orientation for deposition
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== Deep RIE (Bosch Etcher) ==
 
 [[Deep RIE Bosch Etcher]]  
 
  
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 [[AutoStep 200]]  
  
== DUV STEPPER ==
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 [[Deep RIE Bosch Etcher]]  
Current - DUV Stepper Waveguides: [[Media:DUV_Stepper_Waveguides_Development.pptx]]
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DUV Stepper Waveguides Update: [[Media:DUV Stepper Waveguides_2.pptx]]
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 [[DUV Stepper]]  
  
DUV Stepper Waveguides Update: [[Media:DUV Stepper Waveguides_1.pptx]]
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 [[Ebeam4]]  
  
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 [[E-Beam Lithography (EBL)]]  
  
Additional files for
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 [[ICP 2]]  
 [[DUV Lithography Characterization]]  
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== Spin-Rinse-Dry ==
 
 
 [[Spin-Rinse-Dry]]  
 
 [[Spin-Rinse-Dry]]  

Latest revision as of 12:33, 18 April 2013

  • List of tools, manuals, links to NanoFab
  • Bowers-specific processes
  • Remarks, results, optimization runs

Tools[edit]

 AutoStep 200  

 Deep RIE Bosch Etcher  

 DUV Stepper  

 Ebeam4  

 E-Beam Lithography (EBL)  

 ICP 2  

 Spin-Rinse-Dry