Difference between revisions of "Date"

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(Process Issues and Defects)
(Process Issues and Defects)
 
Line 9: Line 9:
 
| [[Jun 08/2012]] || Sweeper Summary||   ||    
 
| [[Jun 08/2012]] || Sweeper Summary||   ||    
 
|-
 
|-
| [[Apr 13/2012]] || HF etching protection, Mesa Litho stripping ||   ||    
+
| [[Arp 13/2012]] || HF etching protection, Mesa Litho stripping ||   ||    
 
|-
 
|-
 
| [[Mar 16/2012]] || HF etching protection, Mesa Litho stripping ||   ||                   
 
| [[Mar 16/2012]] || HF etching protection, Mesa Litho stripping ||   ||                   

Latest revision as of 11:25, 8 June 2012

Process Issues and Defects[edit]

Hybrid Silicon Process
Date Issue or Defect Link
Jun 08/2012 Sweeper Summary    
Arp 13/2012 HF etching protection, Mesa Litho stripping    
Mar 16/2012 HF etching protection, Mesa Litho stripping    
Mar 01/2012 Bonding, Resist coverage, HF wicking, Patterns under EPI    
Feb 29/2012 Bonding