Difference between revisions of "Cleanroom Equipment"

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(Ebeam4)
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== Spin-Rinse-Dry ==  
 
== Spin-Rinse-Dry ==  
 
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 [[Spin-Rinse-Dry]]  
 
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1) Load wafers facing the back of the chamber.
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2) Press "Power" button.
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3) Turn switch to "Hand". (Switch is located behind the tool)
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4) Turn on water valve so the handle is vertical and in line with the pipe.
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(Valve is located behind the tool)
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5) Press "Start" button (Green button below the power button).  Make sure you see water spraying.
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6) Wait until dry cycle begins.
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7) Turn switch back to "Auto".
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8) Turn water valve off.
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9) Remove samples when finished.
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10) Press "Power" button.
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Revision as of 11:49, 15 August 2012

  • List of tools, manuals, links to NanoFab
  • Bowers-specific processes
  • Remarks, results, optimization runs

Ebeam4

  • Very smooth sidewall profile
  • Great sidewall coverage if two directional rotation is used
  • Tool notes
    • Pumping down around 1 hr
    • Use group source
  • Check Deposit Report for images using two different orientation for deposition

Deep RIE (Bosch Etcher)

Restart instructions:

Note:You may have to wait for the temperature to stabilize between some of these steps.

1) Restart computer

2) Log in info (only required when restarting) Username: 3333, Password: 3333

3) Click the "ON" button (in the bottom left)

4) Utilities->Turbo Pump ON

5) Click "Standby" button (again in bottom left)

6) Service->Maintenance->Pump->System (Turbo Pump)

7) Process->Batch...File->Load...Select a batch file to load, then close window

8) Click "Ready" button (again in bottom left)

9) Windows->Overview Diagram...and...You should be ready to go.

DUV STEPPER

Current - DUV Stepper Waveguides: Media:DUV_Stepper_Waveguides_Development.pptx

DUV Stepper Waveguides Update: Media:DUV Stepper Waveguides_2.pptx

DUV Stepper Waveguides Update: Media:DUV Stepper Waveguides_1.pptx


Additional files for  DUV Lithography Characterization  

Spin-Rinse-Dry

 Spin-Rinse-Dry