Difference between revisions of "EPHI"
From OptoelectronicsWiki
(→Processing) |
|||
Line 41: | Line 41: | ||
|} | |} | ||
+ | <br><br> | ||
[[media:Process follower.docx | Complete Process Follower]] | [[media:Process follower.docx | Complete Process Follower]] | ||
{| border="3" | {| border="3" | ||
Line 66: | Line 67: | ||
|- | |- | ||
|} | |} | ||
− | |||
− | |||
− | |||
− | |||
== Characterization == | == Characterization == | ||
... | ... |
Revision as of 20:29, 26 October 2012
Overview
EPHI aims to integrate ultra low-loss waveguides (SiN/SiO2 on Si developed in IPHOD) and high-Q resonators with the hybrid Silicon platform to produce a low-noise oscillator.
Simulations
...
Processing
EPHI Shuttle run-1 (SOA only)
Process ID | Process flow | Process follower | Description |
---|---|---|---|
WG etch | Complete Flow A | Si WG etch | Rib waveguide formation, Alignment marks. |
VC etch | Si VC etch | Vertical channel etch | |
Bonding | Bonding | Plasma assisted wafer bonding guide - Author:Michael D | |
InP-mesa etch | P-mesa etch | Mesa etch to top SCH layer | |
QW wet etch | QW etch | Active layer wet etch | |
N-metal deposition | N-metal deposition | N-metal (Ni/Ge/Au/Ni/Au) | |
Oxide Planarization & Via formation | Planarization & Via etch | 1um oxide deposition & via etch | |
P-/Probepad metal deposition | Probepad metallization | P-/probepad metal stack (Pd/Ti/Pd/Au) |
Process ID | Process flow | Process follower | Description |
---|---|---|---|
WG etch | Complete Flow B | Si WG etch | Rib waveguide formation, Alignment marks. |
VC etch | Si VC etch | Vertical channel etch | |
Bonding | Bonding | Plasma assisted wafer bonding guide - Author:Michael D | |
P-metal deposition | p-metal deposition | P-metal stack (Pd/W) | |
InP-mesa etch | P-mesa etch | Mesa etch to top SCH layer | |
QW wet etch | QW etch | Active layer wet etch | |
N-metal deposition | N-metal deposition | N-metal (Ni/Ge/Au/Ni/Au) | |
Oxide Planarization & Via formation | Planarization & Via etch | 1um oxide deposition & via etch | |
Probepad metal deposition | Probepad metallization | Probepad metal stack (Pd/Ti/Pd/Au) |
Characterization
...