Difference between revisions of "EPHI"

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(Characterization)
(Characterization)
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<b>Dev2 SOA shortloop</b><BR>
 
<b>Dev2 SOA shortloop</b><BR>
[[File:SOA2A1-2E die 2 bar B summary calibrated]]<BR>
+
[[File:SOA2A1-2E_die_2_bar_B_summary_calibrated.xls]]<BR>
[[File:SOA2A1-2E die 2 bar C summary calibrated]]<BR>
+
[[File:SOA2A1-2E_die_2_bar_C_summary_calibrated.xls]]<BR>
[[File:SOA2B3-2E die 2 bar A summary calibrated]]<BR>
+
[[File:SOA2B3-2E_die_2_bar_A_summary_calibrated.xls]]<BR>

Revision as of 10:46, 29 October 2012

Overview

EPHI aims to integrate ultra low-loss waveguides (SiN/SiO2 on Si developed in IPHOD) and high-Q resonators with the hybrid Silicon platform to produce a low-noise oscillator.



Simulations

...



Processing

EPHI Shuttle run-1 (SOA only)

Complete Process Follower

Modules for Process A - Lead Process
Process ID Process flow Process follower Description
WG etch Complete Flow A‎ Si WG etch‎ Rib waveguide formation, Alignment marks.
VC etch   Si VC etch Vertical channel etch
Bonding   Bonding Plasma assisted wafer bonding guide - Author:Michael D
InP-mesa etch   P-mesa etch Mesa etch to top SCH layer
QW wet etch   QW etch Active layer wet etch
N-metal deposition   N-metal deposition N-metal (Ni/Ge/Au/Ni/Au)
Oxide Planarization & Via formation   Planarization & Via etch 1um oxide deposition & via etch
P-/Probepad metal deposition   Probepad metallization P-/probepad metal stack (Pd/Ti/Pd/Au)



Complete Process Follower

Modules for Process B- Catch-up Process
Process ID Process flow Process follower Description
WG etch Complete Flow‎ B Si WG etch‎ Rib waveguide formation, Alignment marks.
VC etch   Si VC etch Vertical channel etch
Bonding   Bonding Plasma assisted wafer bonding guide - Author:Michael D
P-metal deposition   p-metal deposition P-metal stack (Pd/W)
InP-mesa etch   P-mesa etch Mesa etch to top SCH layer
QW wet etch   QW etch Active layer wet etch
N-metal deposition   N-metal deposition N-metal (Ni/Ge/Au/Ni/Au)
Oxide Planarization & Via formation   Planarization & Via etch 1um oxide deposition & via etch
Probepad metal deposition   Probepad metallization Probepad metal stack (Pd/Ti/Pd/Au)



Characterization

Dev2 SOA shortloop
File:SOA2A1-2E die 2 bar B summary calibrated.xls
File:SOA2A1-2E die 2 bar C summary calibrated.xls
File:SOA2B3-2E die 2 bar A summary calibrated.xls