Difference between revisions of "Process Hybrid Silicon"
From OptoelectronicsWiki
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| HSP-SOA-DET-MOD || || || || Hybrid silicon with SOAs, detectors and modulators | | HSP-SOA-DET-MOD || || || || Hybrid silicon with SOAs, detectors and modulators | ||
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+ | | Wafer bonding || || || [[Media:Wafer_Bonding_guide_by_Mike_rev_1.docx | Bonding]]|| Beginner's guide to plasma assisted wafer bonding | ||
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Revision as of 18:50, 12 January 2011
Process ID | Version | Process flow | Process follower | Description |
---|---|---|---|---|
SP-PWD | Si WG etch | Si WG etch | Single etch-step SOI process; passive components | |
SP-VC | Si VC etch | Vertical channel etch | ||
HSP-METCH | Mesa etch | Forms mesa | ||
HSP-QW | III-V QW etch | Quantum well etch | ||
HSP-NETCH | n-layer etch | Remove n-layer to expose Si | ||
HSP-PTLM | p-TLM step | An additional process step is necessary to pattern p-TLM structures | ||
HSP-METAL | thin metal | Thin metal deposition | ||
HSP-PP | Probe pad deposition | Pattern and deposit probe metal | ||
HSP-SOA | Hybrid silicon with SOAs | |||
HSP-MOD | Hybrid silicon with modulators | |||
HSP-DET | Hybrid silicon with detectors | |||
HSP-SOA-DET | Hybrid silicon with SOAs and detectors | |||
HSP-SOA-DET-MOD | Hybrid silicon with SOAs, detectors and modulators | |||
Wafer bonding | Bonding | Beginner's guide to plasma assisted wafer bonding |