Difference between revisions of "Cleanroom Equipment"

From OptoelectronicsWiki
Jump to: navigation, search
(Ebeam4)
Line 4: Line 4:
  
 
== Ebeam4 ==
 
== Ebeam4 ==
* Very smooth sidewall profile
+
 [[Ebeam4]]  
* Great sidewall coverage if two directional rotation is used
+
* Tool notes
+
** Pumping down around 1 hr
+
** Use group source
+
* Check [[media:100520_Ebeam4 Probe Metal Deposition.ppt|Deposit Report]] for images using two different orientation for deposition
+
  
 
== Deep RIE (Bosch Etcher) ==
 
== Deep RIE (Bosch Etcher) ==

Revision as of 11:53, 15 August 2012

  • List of tools, manuals, links to NanoFab
  • Bowers-specific processes
  • Remarks, results, optimization runs

Ebeam4

 Ebeam4  

Deep RIE (Bosch Etcher)

 Deep RIE Bosch Etcher  


DUV STEPPER

Current - DUV Stepper Waveguides: Media:DUV_Stepper_Waveguides_Development.pptx

DUV Stepper Waveguides Update: Media:DUV Stepper Waveguides_2.pptx

DUV Stepper Waveguides Update: Media:DUV Stepper Waveguides_1.pptx


Additional files for  DUV Lithography Characterization  

Spin-Rinse-Dry

 Spin-Rinse-Dry