Difference between revisions of "Chips Table"

Revision as of 09:34, 9 June 2010

**Chip table**
Run ID	wafer	mask	process flow	results
SOIBuffer2R 1				Summary of data.
SOIBuffer2R 2				Grass during mesa etch. New batch started.
SOIBuffer2R 3				Negative PR residue over III-V couldn't be cleaned off. Process follower adjusted.
SOIBuffer2R 4			Process follower	Testing in progress
#1727 W394	Jared design	Lionix	80-nm core
#1727 W395	Jared design	Lionix	80-nm core

@@ Line 10: / Line 10: @@
 | SOIBuffer2R 3 || &nbsp; || &nbsp; || &nbsp; || &nbsp; || &nbsp; || &nbsp; || Negative PR residue over III-V couldn't be cleaned off. Process follower adjusted.
 |-
-| SOIBuffer2R 4 || &nbsp; || [[media:SOIBuffer2R_v2.6.docx | Process follower]] || &nbsp; || &nbsp; || &nbsp; || &nbsp; || Testing in progress
+| SOIBuffer2R 4 || &nbsp; || &nbsp; || [[media:SOIBuffer2R_v2.6.docx | Process follower]] || &nbsp; || &nbsp; || &nbsp; || Testing in progress
 |-
 | #1727 W394 || Jared design || Lionix || 80-nm core || &nbsp; || &nbsp; || &nbsp; || &nbsp;