Difference between revisions of "Initial wafer check"
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| − | ... | + | ==Proposed initial wafer checks== |
| + | [In brackets the results that should go into the process log are given] | ||
| + | * Microscope check of masks [record irregularities, dirt, etc.] | ||
| + | * Microscope check of wafers [record pits, cracks, etc.] | ||
| + | * AFM on SOI wafer [RMS roughness]; | ||
| + | * AFM on III/V wafer [RMS roughness]; | ||
| + | * Verify epitaxial layerstack by wet etch and Dektak [Epi layer thicknesses]; | ||
| + | * ... | ||
| + | |||
| + | <br> | ||
| + | <br> | ||
| + | Back to [[Process Hybrid Silicon]] | ||
Latest revision as of 20:33, 12 January 2012
Proposed initial wafer checks[edit]
[In brackets the results that should go into the process log are given]
- Microscope check of masks [record irregularities, dirt, etc.]
- Microscope check of wafers [record pits, cracks, etc.]
- AFM on SOI wafer [RMS roughness];
- AFM on III/V wafer [RMS roughness];
- Verify epitaxial layerstack by wet etch and Dektak [Epi layer thicknesses];
- ...
Back to Process Hybrid Silicon
