Difference between revisions of "Cleanroom Equipment"

Revision as of 13:58, 14 August 2012

• List of tools, manuals, links to NanoFab
• Bowers-specific processes
• Remarks, results, optimization runs

Ebeam4

• Very smooth sidewall profile
• Great sidewall coverage if two directional rotation is used
• Tool notes
  • Pumping down around 1 hr
  • Use group source
• Check Deposit Report for images using two different orientation for deposition

Spin-Rinse-Dry (SRD) - Bay #7

Deep RIE (Bosch Etcher)

Restart instructions:

Note:You may have to wait for the temperature to stabilize between some of these steps.

1) Restart computer

2) Log in info (only required when restarting) Username: 3333, Password: 3333

3) Click the "ON" button (in the bottom left)

4) Utilities->Turbo Pump ON

5) Click "Standby" button (again in bottom left)

6) Service->Maintenance->Pump->System (Turbo Pump)

7) Process->Batch...File->Load...Select a batch file to load, then close window

8) Click "Ready" button (again in bottom left)

9) Windows->Overview Diagram...and...You should be ready to go.

DUV STEPPER - Bay #7

Current - DUV Stepper Waveguides: Media:DUV_Stepper_Waveguides_Development.pptx

DUV Stepper Waveguides Update: Media:DUV Stepper Waveguides_2.pptx

DUV Stepper Waveguides Update: Media:DUV Stepper Waveguides_1.pptx

Additional files for  DUV Lithography Characterization  

Spin-Rinse-Dry (SRD) - Bay #7

1) Load wafers facing the back of the chamber.

2) Press "Power" button.

3) Turn switch to "Hand". (Switch is located behind the tool)

4) Turn on water valve so the handle is vertical and in line with the pipe. (Valve is located behind the tool)

5) Press "Start" button (Green button below the power button). Make sure you see water spraying.

6) Wait until dry cycle begins.

7) Turn switch back to "Auto".

8) Turn water valve off.

9) Remove samples when finished.

10) Press "Power" button.