Difference between revisions of "Cleanroom Reports"

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(Created page with ''''General Instructions''' *List of etch and deposit rate for cleanroom tools. Each file includes the recipe being used and the calibrated etch rate. *Please update yours if you …')
 
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'''General Instructions'''
 
 
*List of etch and deposit rate for cleanroom tools. Each file includes the recipe being used and the calibrated etch rate.
 
*List of etch and deposit rate for cleanroom tools. Each file includes the recipe being used and the calibrated etch rate.
 
*Please update yours if you run any calibration so that everyone can keep track of them.  
 
*Please update yours if you run any calibration so that everyone can keep track of them.  
 +
  
 
{| border="3"
 
{| border="3"
 
|+ '''Dry Etch'''
 
|+ '''Dry Etch'''
 
|- style="background:red; color:white"
 
|- style="background:red; color:white"
! Equipment !! Etched material !!  Substrate !!Latest etch rate !! Latest update date !! Calib. file !! Note  
+
! Equipment !! Etched material !!  Substrate !!Recipe !!Latest etch rate !! Latest update date !! Calib. file !! Note  
 
|-  
 
|-  
| ICP#2 || Si || SOI ||~ 4nm/sec || APR 02, 2010 || [[media:100402_ICP-2_si_etch_calibration.xls||ICP#2 si etch rate]] ||  
+
| ICP#2 || Si || SOI ||Bowers si etch # 127 ||~ 4nm/sec || APR 02, 2010 || [[media:100402_ICP-2_si_etch_calibration.xls|ICP#2 si etch rate]] ||  
 
|-
 
|-
 
|}
 
|}

Revision as of 12:06, 2 April 2010

  • List of etch and deposit rate for cleanroom tools. Each file includes the recipe being used and the calibrated etch rate.
  • Please update yours if you run any calibration so that everyone can keep track of them.


Dry Etch
Equipment Etched material Substrate Recipe Latest etch rate Latest update date Calib. file Note
ICP#2 Si SOI Bowers si etch # 127 ~ 4nm/sec APR 02, 2010 ICP#2 si etch rate