Difference between revisions of "DesignRules"
From OptoelectronicsWiki
| Line 23: | Line 23: | ||
*Min. 6 um opening | *Min. 6 um opening | ||
*Open up area that is uniform at bottom | *Open up area that is uniform at bottom | ||
| + | |||
| + | |||
| + | Square/Circular TLM patterns design rules | ||
| + | |||
| + | * Distance between adjacent pads - 4 to 30 microns in 5 or more steps. | ||
| + | Smaller the distance, more accurate the estimate. | ||
| + | |||
| + | * Pad width/diameter must be atleast 2x the max distance between pads. | ||
| + | Eg. Say if you have 6 pads with 5,8,12,15,20 micron spacing, it is recommended that the pad be > (2x20) microns wide | ||
| + | |||
| + | * Rectangular/square pads will need to be etched on the outer sides for isolation. That is not the case with circular pads. | ||
| + | |||
| + | * With circular pads, it is difficult to lift-off small rings (<5 microns) | ||
| + | Keep radius between 30-60 microns. | ||
| + | |||
| + | Document with figures to follow soon for further details. | ||
| + | |||
| + | |||
| + | |||
Revision as of 14:40, 21 April 2010
Design Rules
WG
- 3 um trenches for 200 um S-bends keep bending losses minimal
- Put 50 um trench around Verniers and alignment markers
VC
- 10 um x 10 um, 50 um separation
- No VC around verniers, so verviers have a chance of being exposed after substrate removal
Mesa
- 14 um wide
QW
- 16 um wide
Thick p metal
- Same at N metal
- 4 um wide
- Keep 11 um separation between thick P and N metal.
N Metal
- 20 um wide
Implant
- 12 um wide
- Implant after anneal to ensure the quality
Via
- Min. 6 um opening
- Open up area that is uniform at bottom
Square/Circular TLM patterns design rules
- Distance between adjacent pads - 4 to 30 microns in 5 or more steps.
Smaller the distance, more accurate the estimate.
- Pad width/diameter must be atleast 2x the max distance between pads.
Eg. Say if you have 6 pads with 5,8,12,15,20 micron spacing, it is recommended that the pad be > (2x20) microns wide
- Rectangular/square pads will need to be etched on the outer sides for isolation. That is not the case with circular pads.
- With circular pads, it is difficult to lift-off small rings (<5 microns)
Keep radius between 30-60 microns.
Document with figures to follow soon for further details.
Processing Rules
Always put a dummy/witness sample in the chamber when depositing metals and dielectrics.
- Samples can later be used for determining thicknesses.
- These samples can also be used if a given layer has to be etched on the real sample, but etch is not well characterized.
