Cleanroom Reports

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  • List of etch and deposit rate for cleanroom tools. Each file includes the recipe being used and the calibrated etch rate.
  • Please update yours if you run any calibration so that everyone can keep track of them.


Dry Etch
Equipment Etched material Substrate Recipe Latest etch rate Latest update date Latest update by Calib. file Note
ICP#2 Si SOI Bowers si etch # 127 ~ 4nm/sec APR 02, 2010 Hui-Wen ICP#2 si etch rate  


Wet Etch
Etched material Solution Mask Latest etch rate Latest update date Latest update by Calib. file Note
Thermal oxide BHF PR or dielectric ~100nm/min        
PECVD oxide BHF PR or dielectric ~225nm/min        
PECVD SiN HF   ~500nm/min   Geza   PR does not survive as a mask