DesignRules

From OptoelectronicsWiki
Revision as of 09:39, 13 April 2010 by 128.111.239.192 (Talk)

(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to: navigation, search

Design Rules

WG

  • 3 um trenches for 200 um S-bends keep bending losses minimal
  • Put 50 um trench around Verniers and alignment markers

VC

  • 10 um x 10 um, 50 um separation
  • No VC around verniers, so verviers have a chance of being exposed after substrate removal

Mesa

  • 14 um wide

QW

  • 16 um wide

Thick p metal

  • Same at N metal
  • 4 um wide
  • Keep 11 um separation between thick P and N metal.

N Metal

  • 20 um wide

Implant

  • 12 um wide

Via

  • Min. 6 um opening
  • Open up area that is uniform at bottom