Process Hybrid Silicon Overview

Summary

Complete Process Follower

Modules for Process A - Lead Process

Process ID	Process flow	Process follower	Description
WG etch	Complete Flow A‎	Si WG etch‎	Rib waveguide formation, Alignment marks.
VC etch		Si VC etch	Vertical channel etch
Bonding		Bonding	Plasma assisted wafer bonding guide - Author:Michael D
InP-mesa etch		P-mesa etch	Mesa etch to top SCH layer
QW wet etch		QW etch	Active layer wet etch
N-metal deposition		N-metal deposition	N-metal (Ni/Ge/Au/Ni/Au)
Oxide Planarization & Via formation		Planarization & Via etch	1um oxide deposition & via etch
P-/Probepad metal deposition		Probepad metallization	P-/probepad metal stack (Pd/Ti/Pd/Au)

Complete Process Follower

Modules for Process B- Catch-up Process

Process ID	Process flow	Process follower	Description
WG etch	Complete Flow‎ B	Si WG etch‎	Rib waveguide formation, Alignment marks.
VC etch		Si VC etch	Vertical channel etch
Bonding		Bonding	Plasma assisted wafer bonding guide - Author:Michael D
P-metal deposition		p-metal deposition	P-metal stack (Pd/W)
InP-mesa etch		P-mesa etch	Mesa etch to top SCH layer
QW wet etch		QW etch	Active layer wet etch
N-metal deposition		N-metal deposition	N-metal (Ni/Ge/Au/Ni/Au)
Oxide Planarization & Via formation		Planarization & Via etch	1um oxide deposition & via etch
Probepad metal deposition		Probepad metallization	Probepad metal stack (Pd/Ti/Pd/Au)