Process Hybrid Silicon
From OptoelectronicsWiki
| Process ID | Version | Process flow | Process follower | Description |
|---|---|---|---|---|
| SP-PWD | Si WG etch | Si WG etch | Single etch-step SOI process; passive components | |
| SP-VC | Si VC etch | Vertical channel etch | ||
| HSP-METCH | Mesa etch | Forms mesa | ||
| HSP-QW | III-V QW etch | Quantum well etch | ||
| HSP-NETCH | n-layer etch | Remove n-layer to expose Si | ||
| HSP-PTLM | p-TLM step | An additional process step is necessary to pattern p-TLM structures | ||
| HSP-METAL | thin metal | Thin metal deposition | ||
| HSP-PP | Probe pad deposition | Pattern and deposit probe metal | ||
| HSP-SOA | Hybrid silicon with SOAs | |||
| HSP-MOD | Hybrid silicon with modulators | |||
| HSP-DET | Hybrid silicon with detectors | |||
| HSP-SOA-DET | Hybrid silicon with SOAs and detectors | |||
| HSP-SOA-DET-MOD | Hybrid silicon with SOAs, detectors and modulators | |||
| Wafer bonding | Bonding | Beginner's guide to plasma assisted wafer bonding |
