Wafer bonding
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Current Processes[edit]
Bonding Defects - Media:Bonding_Issues.pptx
Bonding Force vs. Torque wrench setting for large circular bondingfixture
big bonding fixture: UC property tag #108000120
Useful references[edit]
EVG has produced some slides on wafer bonding. Do not distribute these outside the group!
They summarize their findings on how bonding works at the molecular level. Details on change in bond strength with time, use of N2 as activation, temp required for good bonding and variation with presence of native oxide / thermal oxide on surface.
