CaseList
From OptoelectronicsWiki
Process Issues and Defects
| Process Step | Issue or Defect | Link | |
|---|---|---|---|
| Initial wafer check | |||
| Dice and cleave | |||
| SOI waveguide | |||
| SOI grating | |||
| SOI actives | |||
| Vertical channel | |||
| Protection layer | |||
| Quantum well intermixing | |||
| Wafer bonding | |||
| Gap fill | |||
| P-mesa | |||
| Lower SCH | |||
| N-InP | |||
| N-metal | |||
| P-metal | |||
| Ion implantation | |||
| Via | |||
| Probe metal | |||
| Remove III/V in gap | |||
| Dice and polish |
