Wafer bonding
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Revision as of 15:28, 3 February 2012 by 128.111.239.148 (Talk)
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Current Processes
Bonding Defects - Media:Bonding_Issues.pptx Bonding Force vs. Torque wrench setting for large circular fixture - Media:bondingfixture.jpg
Useful references
EVG has produced some slides on wafer bonding.
They summarize their findings on how bonding works at the molecular level. Details on change in bond strength with time, use of N2 as activation, temp required for good bonding and variation with presence of native oxide / thermal oxide on surface.