Difference between revisions of "Wafer bonding"
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| + | ==Current Processes== | ||
| + | Bonding | ||
| + | |||
| + | Bonding Defects - [[media:bonding.xlsx|Si WG etch]] | ||
| + | |||
| + | Process flow - [[media:WG.pptx|Si WG etch]] | ||
| + | |||
| + | ==Suggestions for modified process== | ||
| + | [[media:Silicon processing.pptx|10282011_HSP]] | ||
Revision as of 10:45, 3 November 2011
Back to Process_Hybrid_Silicon.
Current Processes
Bonding
Bonding Defects - Si WG etch
Process flow - Si WG etch
