Difference between revisions of "Wafer bonding"
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− | ... | + | Back to [[Process_Hybrid_Silicon]]. |
+ | ==Current Processes== | ||
+ | Bonding | ||
+ | |||
+ | Bonding Defects - [[media:bonding.xlsx|Si WG etch]] | ||
+ | |||
+ | Process flow - [[media:WG.pptx|Si WG etch]] | ||
+ | |||
+ | ==Suggestions for modified process== | ||
+ | [[media:Silicon processing.pptx|10282011_HSP]] |
Revision as of 10:45, 3 November 2011
Back to Process_Hybrid_Silicon.
Current Processes
Bonding
Bonding Defects - Si WG etch
Process flow - Si WG etch