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CUBiC (SRC/DARPA):
This center,
running from 2023-2027, under the leadershiop of Prof. Bergman of Columbia
university, seeks to develop new generations of high capacity wireless,
wireline, and optical communications networks. Rodwell group will, under this
program, develop high-capacity, massive-scale CMOS mm-wave transmitter and
receiver arrays in the 70 GHz and 140 GHz bands, seeking breathrough
combinations of range, data rate, and link robustness (margins against
failure by attenuation or beam blockage).
IC design, System Design.
RINGS (NSF):
In this program,
in collaboration with Prof. Madhow, we seek to develop high capacity mmwave
communications links using massive scale CMOS transceivers.
IC design, System Design.
4D-100 (NSF):
In this
program, in collaboration with Profs. Madhow and Buckwalter, we seek to
develop CMOS ICs, modules, and systems for 140 GHz imaging radar.
IC design, System Design.
FUSE (NSF)
In this program
we seek to develop low-cost packaging technology for mm-wave CMOS arrays.
IC design, System Design.
FUSE II (NSF)
In this program,
we are collaborating with Profs. Wooram Lee and Madhavan Swaminathan of Penn State
University to develop fully integrated phase array transmitters and receivers
in the 200-300 GHz band
IC design, Package Development.
ELGAR (DARPA/Teledyne)
The ELGAR program seeks to develop IC
technologies for 220 GHz phased arrays. UCSB's role, in collaboration with
Teledyne, is to demostrate record-efficiency 220 GHz power amplifiers.
IC design,
220 GHz arrays (Air Force/Teledyne)
This program
seeks to develop phase-array transmitters and receivers for the 220 GHz band.
IC design, package and module
developement
Dielectric waveguide interconnects
(SRC)
In this program
we seek to develop technologies for high-capacity, 1-10 meter range
dielectric waveguide interconnects for digital systems.
IC design, Electromagnetic
design.
CA DREAMs program
This new
industry-university program will develop US infrastructure in high-frequency
semiconductors and systems. Rodwell group's efforts may include THz
transistors, mm-wave ICs, and mm-wave arrays.
transistors, IC design, system
design
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