Difference between revisions of "SWEEPER"

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Process overview:  [[file:SWEEPER4-1_v3.ppt]]
 
Process overview:  [[file:SWEEPER4-1_v3.ppt]]
  
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'''RUN 3.2 (Hybrid Silicon only for SOA tests)'''<br>
 
'''RUN 3.2 (Hybrid Silicon only for SOA tests)'''<br>
 
[http://optoelectronics.ece.ucsb.edu/oewiki/index.php/EPHI (combined with EPHI Dev2 Run)]
 
[http://optoelectronics.ece.ucsb.edu/oewiki/index.php/EPHI (combined with EPHI Dev2 Run)]

Revision as of 14:49, 27 November 2012

Overview

SWEEPER, formally known as "Chip-scale Integrated Photonic Phased Array" (CHIPPA) aims to produce a phased array of waveguide-coupled surface gratings integrated with an on-chip tunable laser, amplifiers, and phase modulators for free-space beam control in 2 axes.

Simulations

Run 2 current injection modulator:

Processing

RUN 4.1 (Hybrid Silicon only for tunable lasers)
Process overview: File:SWEEPER4-1 v3.ppt





RUN 3.2 (Hybrid Silicon only for SOA tests)
(combined with EPHI Dev2 Run)

RUN 3.1 (active Silicon only for fast phase modulator tests)
Media:SWEEPER_3.1_Gratings.zip


Current Traveler for ACTIVES Run 3 - Phase modulator run: Media:SWEEPER Actives Trav v21_2b ACTIVE SI ONLY.docx <-- note the new dopant anneal recipe: 5mins instead of 10.
Old Traveler for ACTIVES Run 3 - Phase modulator run: Media:SWEEPER Actives Trav v21_1 ACTIVE SI ONLY.docx

Powerpoint overview (trav 21_2): Media:process flow SWEEPER RUN3_1 trav v21_2.pptx

Planned schedule for ACTIVES Run 3 - Phase modulator run: aSi-PM Process Schedule

Mask set: Media:SWEEPER 3_1 - aSi Shortloop v12.zip
Mask set showing EBL layer: Media:SWEEPER 3_1 - aSi_Shortloop_v12B (EBL incl).zip (top cell is AAA_aSi_FULL_FLAT)

Chip status is maintained on a google doc: Google doc traveller

Current Anneal Recipes for ACTIVES Run 1:: Media:Sweeper_Anneal_Recipe.xlsx‎

RUN 2.4 (hybrid Silicon only for Phase 1 tunable lasers retest)
Traveler: Media:SWEEPER_MDHybrid_Trav_v02_HYBRID_SI_ONLY.docx
Mask set through EBL: Media:SWP_2-4_WG2-VC-EBL.zip

RUN 2.3 (hybrid Silicon only for Phase 1 tunable lasers test)
Traveler used for ACTIVES Run 1A (hybrid silicon only - no active silicon): Media:SWEEPER Actives Trav vH20_2_HYBRID-ONLY.docx

RUN 2.2 (both active and hybrid Silicon for Phase 1 PIC)
Traveler used for ACTIVES Run 1 (full process, chips A-E, produced chips A2, E1, E2): Media:SWEEPER Actives Trav v20_1.docx
Mask used for ACTIVES Run 1: Media:SWEEPER_ACTIVES85_TAPEDOUT.zip

RUN 2.1 (active Silicon for Phase 1 intermediate testing)
Prior traveler for ACTIVES Run 1 (active Si only): Media:SWEEPER Actives Trav v15_3.xls


RUN 1.2(spring/summer 2011 - passive SWEEPER for Phase 1 with revisions to avoid grating damage)
Traveler for Run 2B: Media:110202 Sweeper Rev1.1 Run 2B.xls

RUN 1.1(early spring 2011 - passive SWEEPER for Phase 1)
Traveler for Run 1: Media:110202_Sweeper_Rev1_Batch_1.xls

Powerpoint overview can be found here Media:SWEEPER_process_flow.pptx

Prelim mask:

File:SWEEPER ACTIVES55 semifinal flat2.cif

File:SWEEPER ACTIVES59 semifinal flat2.cif

Grating Reports:

Media:Sweeper_Run_2B_-_GratingReport-2.pptx

Characterization

aSI PHASE MODULATOR RUN - Sweeper 3.1
Run 1

Step - Description - Sample Names - File

3.3 - Rib litho pics before hard mask etch: File:Rib litho pics.zip

3.4 - Rib Pics before Si Etch - Dummy 1 : File:Dummy post pr strip pre rib etch.zip

3.4 - Rib Pics before Si Etch - Sample 1: File:Sample1 pre si etch.zip

3.4 - Rib Pics before Si Etch - Sample 2: File:Sample2 pre si etch.zip

3.5 - Rib Pics post Si Etch - Sample 2: File:Sample2 post si etch.zip

Run 2

File:P1vid.zip

Step - Description - Sample Names - File

3.5 - SEM post Si Etch - Dummy 2: File:Dummy2 SEM post si etch.zip

4.4 - N-Dope Litho (Implant 3A) - Sample 3 & 4: File:Ndopelithopics.zip

4.5 - Post Implant 3A PR Strip - Sample 3 & 4: File:Post imp3A PR strip.zip

5.3 - P-Dope1 Litho (Implant 3B) - Sample 3 & 4: File:Implant3B litho.zip

5.4 - Post Implant 3B PR Strip: Media:post_imp3B_PR_strip.jpg

6.3 - P-Dope2 Litho (Implant 3C) - Sample 3 & 4: File:Implant3C litho.zip

6.4 - Post Implant 3C Partial PR Strip, "Cracks" - S3_Dies 1,2: File:Cracking Pics post 3C Strip 1.jpg

7.1 - Post 1050C Anneal (S3 and Dum2 taken to unknown temp): File:Post 1050C anneal pics.zip

9.2 - Via 1 Litho - Dum2, S3, S4: File:Via 1 litho pics.zip

9.4 - Via 1 Etched, PR Stripped: File:Via1 Etch PR Stripped.zip

10.1 - Failed Contact (NMetal) Litho - Dum2, S3, S4: File:Failed contact Litho.zip

10.1 - Contact (NMetal) Litho - File:NMetal Litho.zip

10.3 - Contact Metal Liftoff - File:Liftoff Results.zip

12.2 - Via 2 Litho - File:Via2Litho.zip

12.3 - Post 5 & 10 min SU8 etch - File:Post5and10minetchsu8.zip

12.. - SU8 Removal - SiNetch 2.5' + SU8 etch 3.5'+3.5' + ISO u/s 5' + Piranha 1' - File:Su8removalpostpiranhadip.zip

13.1 - SU8 Swabbed off/ PRMetal Litho - Sample 4 - File:SwabbingSU8 & ProbeMetalLitho.zip

13.4 - 2nd PRMetal Layer Lifted off - Sample 4 - File:2nd PRMetal Layer 9 5 12.zip

14.4 - Post Grating Opening Etch/Strip - Sample 4 - File:9 7postGOstrip.zip

PASSIVES RUN
Passive grating results: File:Sweeper Q2.doc
2D beam steering results, OFC video: File:OFC Doylend vid2.zip