Difference between revisions of "SWEEPER"

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SWEEPER, formally known as "Chip-scale Integrated Photonic Phased Array" (CHIPPA) aims to produce a phased array of waveguide-coupled surface gratings integrated with an on-chip tunable laser, amplifiers, and phase modulators for free-space beam control in 2 axes.
 
SWEEPER, formally known as "Chip-scale Integrated Photonic Phased Array" (CHIPPA) aims to produce a phased array of waveguide-coupled surface gratings integrated with an on-chip tunable laser, amplifiers, and phase modulators for free-space beam control in 2 axes.
 
Powerpoint overview can be found here [[Media:SWEEPER_process_flow.pptx]]
 
  
 
== Simulations ==
 
== Simulations ==
  
Run 2 current injection modulator:
+
update this for SWEEPER 5A
  
 
== Processing ==
 
== Processing ==
'''Traveler for ACTIVES Run 1 can be found here:'''  [[File:Example.jpg]]
 
  
Traveler for Run 1 can be found here [[Media:110202_Sweeper_Rev1_Batch_1.xls]]
+
'''RUN 5.A (SWEEPER Phase II 32x Si PIC)'''<br>
 +
Process overview:  [[file:SWEEPER5A_v04.ppt]]<br>
 +
Process traveller:  [[file:SWEEPER5_Trav-v04.docx]]<br>
 +
Google docs traveller (shows real-time results and progress): [https://docs.google.com/spreadsheet/ccc?key=0Aj-K6MNgH5hRdHV4Z1drOU8wbGNKR1dReUtzd2dEY3c&usp=sharing] <br><br>
 +
Anneal breakout traveller:  [[file:SWEEPER5_Trav-v02b_ANNEALBREAKOUT.docx]]<br><br>
 +
Proton implant recipe:  [[file:proton implant recipe summary.pptx]]<br><br>
 +
Previous traveller: 
 +
*[[file:SWEEPER5_Trav-v01.docx]]<br>
 +
*[[file:SWEEPER5_Trav-v02b.docx]]<br>
 +
*[[file:SWEEPER5_Trav-v03.docx]]<br><br>
  
Traveler for Run 2B can be found here [[Media:110202 Sweeper Rev1.1 Run 2B.xls]]
+
Full Mask set version 31:  [[file:SWEEPER5_v31.gds]]<br>
 +
Full Mask set with correct polarity version 31:  [[file:SWEEPER5_v31_polarity.gds]]<br>
 +
Mask Layer Layout Properties: [[file:Sweeper5_31_lyp.zip]]<br><br>
  
Chip Status for Second Run of Sweeper can be found here [[Media:2011_12_19_Sweep_Run_2_Chips.xlsx‎]]
+
Mask with Gratings Layout:  [[file:Sweeper5_v35_Gratings.gds]]<br>
 +
Mask with new Grating test structures for split:  [[file:Sweeper5_v35_GratingsSplit.gds]]<br>
 +
Grating Mask Layer Layout Properties: [[file:Sweeper5_GratingsLyp.zip]]<br><br>
  
Grating Reports:
+
starter mask set: [[file:SWEEPER5_lyrs4.gds]]<br><br>
  
  [[Media:Sweeper_Run_2B_-_GratingReport-2.pptx]]
+
'''RUN 4.1 (Hybrid Silicon only for tunable lasers)'''<br>
 +
Process overview: [[file:SWEEPER4-1_v4.ppt]]<br>
 +
Process traveller:  [[file:SWEEPER_HSi-Trav31.0_Run4.1.docx]]<br>
 +
Google docs traveller (shows real-time results and progress): [https://docs.google.com/folder/d/0Bz-K6MNgH5hRZHdoVUlQN3BhTWM/edit] <br>
 +
Previous traveller:  [[file:SWEEPER_HSi-Trav30.2_Run4.1.docx]]<br>
 +
Mask set:  [[file:SWEEPER4.zip]]
  
 +
'''RUN 3.2 (Hybrid Silicon only for SOA tests)'''<br>
 +
[https://optoelectronics.ece.ucsb.edu/oewiki/index.php/EPHI (combined with EPHI Dev2 Run)]
  
Prelim mask:
+
'''RUN 3.1 (active Silicon only for fast phase modulator tests)'''<br>
 +
[[Media:SWEEPER_3.1_Gratings.zip]]<br>
 +
Current Traveler for ACTIVES Run 3 - Phase modulator run:  [[Media:SWEEPER Actives Trav v21_2b ACTIVE SI ONLY.docx]]  <FONT COLOR=RED> <-- note the new dopant anneal recipe:  5mins instead of 10. </FONT><br>
 +
Old Traveler for ACTIVES Run 3 - Phase modulator run:  [[Media:SWEEPER Actives Trav v21_1 ACTIVE SI ONLY.docx]]<br>
 +
Powerpoint overview (trav 21_2): [[Media:process flow SWEEPER RUN3_1 trav v21_2.pptx]]<br>
 +
Planned schedule for ACTIVES Run 3 - Phase modulator run:  [https://docs.google.com/spreadsheet/ccc?key=0Aj-K6MNgH5hRdEt0U0lrOFpXUGVmYTNhRlhZVXVZQnc#gid=0 aSi-PM Process Schedule]<br>
 +
Mask set: [[Media:SWEEPER 3_1 - aSi Shortloop v12.zip]]<br>
 +
Mask set showing EBL layer:  [[Media:SWEEPER 3_1 - aSi_Shortloop_v12B (EBL incl).zip]]  (top cell is AAA_aSi_FULL_FLAT)<br>
 +
Chip status is maintained on a google doc: [https://docs.google.com/spreadsheet/pub?hl=en_US&hl=en_US&key=0AslEbZ1yEnOHdGstd240eHJKMGhCSFZuN3F0TjVxNnc&output=html Google doc traveller]<br>
 +
Current Anneal Recipes for ACTIVES Run 1::  [[Media:Sweeper_Anneal_Recipe.xlsx‎]]
  
[[File:SWEEPER_ACTIVES55_semifinal_flat2.cif]]
+
'''RUN 2.4 (hybrid Silicon only for Phase 1 tunable lasers retest)'''<br>
 +
Traveler:  [[Media:SWEEPER_MDHybrid_Trav_v02_HYBRID_SI_ONLY.docx]] <br>
 +
Mask set through EBL:  [[Media:SWP_2-4_WG2-VC-EBL.zip]]
  
[[File:SWEEPER_ACTIVES59_semifinal_flat2.cif]]
+
'''RUN 2.3 (hybrid Silicon only for Phase 1 tunable lasers test)'''<br>
 +
Traveler used for ACTIVES Run 1A (hybrid silicon only - no active silicon):  [[Media:SWEEPER Actives Trav vH20_2_HYBRID-ONLY.docx]]
 +
 
 +
'''RUN 2.2 (both active and hybrid Silicon for Phase 1 PIC)'''<br>
 +
Traveler used for ACTIVES Run 1 (full process, chips A-E, produced chips A2, E1, E2):  [[Media:SWEEPER Actives Trav v20_1.docx]]<br>
 +
Mask used for ACTIVES Run 1:  [[Media:SWEEPER_ACTIVES85_TAPEDOUT.zip]]
 +
 
 +
'''RUN 2.1 (active Silicon for Phase 1 intermediate testing)'''<br>
 +
Prior traveler for ACTIVES Run 1 (active Si only):  [[Media:SWEEPER Actives Trav v15_3.xls]]
 +
 
 +
'''RUN 1.2(spring/summer 2011 - passive SWEEPER for Phase 1 with revisions to avoid grating damage)'''<br>
 +
Traveler for Run 2B: [[Media:110202 Sweeper Rev1.1 Run 2B.xls]]
 +
 
 +
'''RUN 1.1(early spring 2011 - passive SWEEPER for Phase 1)''' <br>
 +
Traveler for Run 1: [[Media:110202_Sweeper_Rev1_Batch_1.xls]]<br>
 +
Powerpoint overview can be found here [[Media:SWEEPER_process_flow.pptx]]<br>
 +
Prelim mask:<br>
 +
[[File:SWEEPER_ACTIVES55_semifinal_flat2.cif]]<br>
 +
[[File:SWEEPER_ACTIVES59_semifinal_flat2.cif]]<br>
 +
Grating Reports:<br>
 +
[[Media:Sweeper_Run_2B_-_GratingReport-2.pptx]]
  
 
== Characterization ==
 
== Characterization ==
 +
<u><b>'''Sweeper 5A - Phase II Si 32x PIC'''</b></u> <br>
 +
Rib Etch SEMs - [[File:Rib_Etch_SEMs.zip]]<br>
 +
NDope Litho - [[File:NDopeLitho.zip]]<br>
 +
PDope Litho - [[File:PDopeLitho.zip]]<br>
 +
 +
DBR test gratings and Lens Array SEMs - [[File:DBR_test_gratings_&_lens.zip]]<br>
 +
 +
 +
<u><b>Hybrid SI Tunable Laser re-RUN - Sweeper 4.1</b></u>  <br>
 +
'''Run 4.1'''<br>
 +
Post Bond ''Macroscopic'' Pictures - Samples H,I,J,K - [[File:SW4_1_PostBond+100nmOxide_Macroscopic.zip]]<br>
 +
Post Bond ''Microscopic'' Pictures - Samples H,I,J,K - [[File:SW4_1_PostBond+100nmOxide_Microscopic.zip]]<br>
 +
PMesa Etch Rie 2 traces - [[File:SW4_1_MesaEtch_Rie2Traces.zip]]<br>
 +
PMesa Etch SEMs - [[File:PMEtch.zip]]<br>
 +
QW Etch SEMs - [[File:QWetch.zip]] - Shows roughness of RIE2 etch vs the smoothness of the wet etch<br>
 +
NMetal Litho Pictures - Samples I - [[File:nmetallithochipi.zip]]<br>
 +
NMetal Liftoff Pictures - Samples I,J,K - [[File:nmetalliftoff.zip]] - Shows stringers, bubbles, failed liftoff, uneven RIE2 etch(?) in certain areas.<br>
 +
N-InP Etch Picture - Samples K - [[Media:NInP_Etch_K_1.png]]<br>
 +
VIA1 Litho - Sample K - [[File:Via1Litho_K_R1C1.zip]] - Shows how mesa pattern is compressed with respect to Via1 pattern.<br>
 +
VIA1 etch AFM results - [[File:AFM after via etch analyzed.zip]]<br>
 +
VIA1 Blanket etch Dektaks - [[File:Via_Blanket_Etch_Dektaks.zip]]<br>
 +
ThermoOptic Metal Litho - [[File:ToMetLitho.zip]]<br>
 +
Post Via2 Etch Strip Stringers - [[File:Post Via2 Etch Strip Stringers.zip]]<br>
 +
Post Via2 Litho Cracking - [[File:PostVia2LithoCracking.zip]]<br>
 +
Post-Unaxis-Oxide-Deposition Failed Photoresist Spin - [[Media:J_badPRspin.jpg]] - Recipe Barton_SiO2_50C.  Solution: solvent clean, dehydration bake, 2 min PEII at 200W<br>
 +
 +
IVs spot Check 1_28_13 - [[File:IVs - Preliminary - 1_28_13.zip]]<br>
 +
LIVs 2_1_13 - [[File:LIVs - 2_1_13.zip]]<br>
 +
LIVs 2_4_13 - [[File:LIVs - 2_4_13.zip]]<br>
 +
 +
'''LIVs in Excel - SGDBR 29 Lasers found - [[File:LIVs_Excel.zip]]'''<br>
 +
'''Chip K - Vernier 05 - LIV and OSA data - [[File:K_R1C2_Vernier05.xlsx]]'''<br>
 +
OSA_K_SummaryFiles - [[File:OSA_K_SummaryFiles.zip]]<br>
 +
 +
<br><br>
 +
<u><b>aSI PHASE MODULATOR RUN - Sweeper 3.1</b></u>  <br>
 +
'''Run 1'''
 +
Step -        Description        - Sample Names - File<br>
 +
3.3  - Rib litho pics before hard mask etch:  [[File:rib litho pics.zip]]<br>
 +
3.4  - Rib Pics before Si Etch    - Dummy 1 :  [[File:dummy_post_pr_strip_pre_rib_etch.zip]]<br>
 +
3.4  - Rib Pics before Si Etch    - Sample 1:  [[File:sample1_pre_si_etch.zip]]<br>
 +
3.4  - Rib Pics before Si Etch    - Sample 2:  [[File:sample2_pre_si_etch.zip]]<br>
 +
3.5  - Rib Pics post Si Etch      - Sample 2:  [[File:sample2_post_si_etch.zip]]<br>
 +
'''Run 2'''
 +
[[File:P1vid.zip]]<br>
 +
Step -        Description        - Sample Names - File<br>
 +
3.5  - SEM post Si Etch          - Dummy 2:      [[File:Dummy2_SEM_post_si_etch.zip]]<br>
 +
4.4  - N-Dope Litho (Implant 3A)  - Sample 3 & 4: [[File:ndopelithopics.zip]]<br>
 +
4.5  - Post Implant 3A PR Strip  - Sample 3 & 4: [[File:post_imp3A_PR_strip.zip]]<br>
 +
5.3  - P-Dope1 Litho (Implant 3B) - Sample 3 & 4: [[File:implant3B_litho.zip]]<br>
 +
5.4  - Post Implant 3B PR Strip:                  [[Media:post_imp3B_PR_strip.jpg]]<br>
 +
6.3  - P-Dope2 Litho (Implant 3C) - Sample 3 & 4: [[File:implant3C_litho.zip]]<br>
 +
6.4  - Post Implant 3C Partial PR Strip, "Cracks" - S3_Dies 1,2: [[File:Cracking_Pics_post_3C_Strip_1.jpg]]<br>
 +
7.1  - Post 1050C Anneal (S3 and Dum2 taken to unknown temp): [[File:post_1050C_anneal_pics.zip]]<br>
 +
9.2  - Via 1 Litho                - Dum2, S3, S4: [[File:Via_1_litho_pics.zip]]<br>
 +
9.4  - Via 1 Etched, PR Stripped:                [[File:Via1_Etch_PR_Stripped.zip]]<br>
 +
10.1 - Failed Contact (NMetal) Litho - Dum2, S3, S4: [[File:failed_contact_Litho.zip]] <br>
 +
10.1 - Contact (NMetal) Litho - [[File:NMetal Litho.zip]]<br>
 +
10.3 - Contact Metal Liftoff - [[File:Liftoff Results.zip]]<br>
 +
12.2 - Via 2 Litho - [[File:Via2Litho.zip]]<br>
 +
12.3 - Post 5 & 10 min SU8 etch - [[File:post5and10minetchsu8.zip]]<br>
 +
12.. - SU8 Removal - SiNetch 2.5' + SU8 etch 3.5'+3.5' + ISO u/s 5' + Piranha 1'  - [[File:su8removalpostpiranhadip.zip]]<br>
 +
13.1 - SU8 Swabbed off/ PRMetal Litho - Sample 4 - [[File:SwabbingSU8_&_ProbeMetalLitho.zip]]<br>
 +
13.4 - 2nd PRMetal Layer Lifted off - Sample 4 - [[File:2nd PRMetal Layer 9_5_12.zip]]<br>
 +
14.4 - Post Grating Opening Etch/Strip - Sample 4 - [[File:9_7postGOstrip.zip]]<br>
 +
 +
<u><b>PASSIVES RUN</b></u>  <br>
 +
Passive grating results:  [[File:sweeper_Q2.doc]] <br>
 +
2D beam steering results, OFC video: [[File:OFC_Doylend_vid2.zip]]
  
Passive grating results:  [[Media:sweeper_Q2.doc]]
 
  
2D beam steering results, run 1:
+
&nbsp;[[Jared_Misc]] &nbsp;

Latest revision as of 09:13, 5 August 2013

Overview[edit]

SWEEPER, formally known as "Chip-scale Integrated Photonic Phased Array" (CHIPPA) aims to produce a phased array of waveguide-coupled surface gratings integrated with an on-chip tunable laser, amplifiers, and phase modulators for free-space beam control in 2 axes.

Simulations[edit]

update this for SWEEPER 5A

Processing[edit]

RUN 5.A (SWEEPER Phase II 32x Si PIC)
Process overview: File:SWEEPER5A v04.ppt
Process traveller: File:SWEEPER5 Trav-v04.docx
Google docs traveller (shows real-time results and progress): [1]

Anneal breakout traveller: File:SWEEPER5 Trav-v02b ANNEALBREAKOUT.docx

Proton implant recipe: File:Proton implant recipe summary.pptx

Previous traveller:

Full Mask set version 31: File:SWEEPER5 v31.gds
Full Mask set with correct polarity version 31: File:SWEEPER5 v31 polarity.gds
Mask Layer Layout Properties: File:Sweeper5 31 lyp.zip

Mask with Gratings Layout: File:Sweeper5 v35 Gratings.gds
Mask with new Grating test structures for split: File:Sweeper5 v35 GratingsSplit.gds
Grating Mask Layer Layout Properties: File:Sweeper5 GratingsLyp.zip

starter mask set: File:SWEEPER5 lyrs4.gds

RUN 4.1 (Hybrid Silicon only for tunable lasers)
Process overview: File:SWEEPER4-1 v4.ppt
Process traveller: File:SWEEPER HSi-Trav31.0 Run4.1.docx
Google docs traveller (shows real-time results and progress): [2]
Previous traveller: File:SWEEPER HSi-Trav30.2 Run4.1.docx
Mask set: File:SWEEPER4.zip

RUN 3.2 (Hybrid Silicon only for SOA tests)
(combined with EPHI Dev2 Run)

RUN 3.1 (active Silicon only for fast phase modulator tests)
Media:SWEEPER_3.1_Gratings.zip
Current Traveler for ACTIVES Run 3 - Phase modulator run: Media:SWEEPER Actives Trav v21_2b ACTIVE SI ONLY.docx <-- note the new dopant anneal recipe: 5mins instead of 10.
Old Traveler for ACTIVES Run 3 - Phase modulator run: Media:SWEEPER Actives Trav v21_1 ACTIVE SI ONLY.docx
Powerpoint overview (trav 21_2): Media:process flow SWEEPER RUN3_1 trav v21_2.pptx
Planned schedule for ACTIVES Run 3 - Phase modulator run: aSi-PM Process Schedule
Mask set: Media:SWEEPER 3_1 - aSi Shortloop v12.zip
Mask set showing EBL layer: Media:SWEEPER 3_1 - aSi_Shortloop_v12B (EBL incl).zip (top cell is AAA_aSi_FULL_FLAT)
Chip status is maintained on a google doc: Google doc traveller
Current Anneal Recipes for ACTIVES Run 1:: Media:Sweeper_Anneal_Recipe.xlsx‎

RUN 2.4 (hybrid Silicon only for Phase 1 tunable lasers retest)
Traveler: Media:SWEEPER_MDHybrid_Trav_v02_HYBRID_SI_ONLY.docx
Mask set through EBL: Media:SWP_2-4_WG2-VC-EBL.zip

RUN 2.3 (hybrid Silicon only for Phase 1 tunable lasers test)
Traveler used for ACTIVES Run 1A (hybrid silicon only - no active silicon): Media:SWEEPER Actives Trav vH20_2_HYBRID-ONLY.docx

RUN 2.2 (both active and hybrid Silicon for Phase 1 PIC)
Traveler used for ACTIVES Run 1 (full process, chips A-E, produced chips A2, E1, E2): Media:SWEEPER Actives Trav v20_1.docx
Mask used for ACTIVES Run 1: Media:SWEEPER_ACTIVES85_TAPEDOUT.zip

RUN 2.1 (active Silicon for Phase 1 intermediate testing)
Prior traveler for ACTIVES Run 1 (active Si only): Media:SWEEPER Actives Trav v15_3.xls

RUN 1.2(spring/summer 2011 - passive SWEEPER for Phase 1 with revisions to avoid grating damage)
Traveler for Run 2B: Media:110202 Sweeper Rev1.1 Run 2B.xls

RUN 1.1(early spring 2011 - passive SWEEPER for Phase 1)
Traveler for Run 1: Media:110202_Sweeper_Rev1_Batch_1.xls
Powerpoint overview can be found here Media:SWEEPER_process_flow.pptx
Prelim mask:
File:SWEEPER ACTIVES55 semifinal flat2.cif
File:SWEEPER ACTIVES59 semifinal flat2.cif
Grating Reports:

Media:Sweeper_Run_2B_-_GratingReport-2.pptx

Characterization[edit]

Sweeper 5A - Phase II Si 32x PIC
Rib Etch SEMs - File:Rib Etch SEMs.zip
NDope Litho - File:NDopeLitho.zip
PDope Litho - File:PDopeLitho.zip

DBR test gratings and Lens Array SEMs - File:DBR test gratings & lens.zip


Hybrid SI Tunable Laser re-RUN - Sweeper 4.1
Run 4.1
Post Bond Macroscopic Pictures - Samples H,I,J,K - File:SW4 1 PostBond+100nmOxide Macroscopic.zip
Post Bond Microscopic Pictures - Samples H,I,J,K - File:SW4 1 PostBond+100nmOxide Microscopic.zip
PMesa Etch Rie 2 traces - File:SW4 1 MesaEtch Rie2Traces.zip
PMesa Etch SEMs - File:PMEtch.zip
QW Etch SEMs - File:QWetch.zip - Shows roughness of RIE2 etch vs the smoothness of the wet etch
NMetal Litho Pictures - Samples I - File:Nmetallithochipi.zip
NMetal Liftoff Pictures - Samples I,J,K - File:Nmetalliftoff.zip - Shows stringers, bubbles, failed liftoff, uneven RIE2 etch(?) in certain areas.
N-InP Etch Picture - Samples K - Media:NInP_Etch_K_1.png
VIA1 Litho - Sample K - File:Via1Litho K R1C1.zip - Shows how mesa pattern is compressed with respect to Via1 pattern.
VIA1 etch AFM results - File:AFM after via etch analyzed.zip
VIA1 Blanket etch Dektaks - File:Via Blanket Etch Dektaks.zip
ThermoOptic Metal Litho - File:ToMetLitho.zip
Post Via2 Etch Strip Stringers - File:Post Via2 Etch Strip Stringers.zip
Post Via2 Litho Cracking - File:PostVia2LithoCracking.zip
Post-Unaxis-Oxide-Deposition Failed Photoresist Spin - Media:J_badPRspin.jpg - Recipe Barton_SiO2_50C. Solution: solvent clean, dehydration bake, 2 min PEII at 200W

IVs spot Check 1_28_13 - File:IVs - Preliminary - 1 28 13.zip
LIVs 2_1_13 - File:LIVs - 2 1 13.zip
LIVs 2_4_13 - File:LIVs - 2 4 13.zip

LIVs in Excel - SGDBR 29 Lasers found - File:LIVs Excel.zip
Chip K - Vernier 05 - LIV and OSA data - File:K R1C2 Vernier05.xlsx
OSA_K_SummaryFiles - File:OSA K SummaryFiles.zip



aSI PHASE MODULATOR RUN - Sweeper 3.1
Run 1 Step - Description - Sample Names - File
3.3 - Rib litho pics before hard mask etch: File:Rib litho pics.zip
3.4 - Rib Pics before Si Etch - Dummy 1 : File:Dummy post pr strip pre rib etch.zip
3.4 - Rib Pics before Si Etch - Sample 1: File:Sample1 pre si etch.zip
3.4 - Rib Pics before Si Etch - Sample 2: File:Sample2 pre si etch.zip
3.5 - Rib Pics post Si Etch - Sample 2: File:Sample2 post si etch.zip
Run 2 File:P1vid.zip
Step - Description - Sample Names - File
3.5 - SEM post Si Etch - Dummy 2: File:Dummy2 SEM post si etch.zip
4.4 - N-Dope Litho (Implant 3A) - Sample 3 & 4: File:Ndopelithopics.zip
4.5 - Post Implant 3A PR Strip - Sample 3 & 4: File:Post imp3A PR strip.zip
5.3 - P-Dope1 Litho (Implant 3B) - Sample 3 & 4: File:Implant3B litho.zip
5.4 - Post Implant 3B PR Strip: Media:post_imp3B_PR_strip.jpg
6.3 - P-Dope2 Litho (Implant 3C) - Sample 3 & 4: File:Implant3C litho.zip
6.4 - Post Implant 3C Partial PR Strip, "Cracks" - S3_Dies 1,2: File:Cracking Pics post 3C Strip 1.jpg
7.1 - Post 1050C Anneal (S3 and Dum2 taken to unknown temp): File:Post 1050C anneal pics.zip
9.2 - Via 1 Litho - Dum2, S3, S4: File:Via 1 litho pics.zip
9.4 - Via 1 Etched, PR Stripped: File:Via1 Etch PR Stripped.zip
10.1 - Failed Contact (NMetal) Litho - Dum2, S3, S4: File:Failed contact Litho.zip
10.1 - Contact (NMetal) Litho - File:NMetal Litho.zip
10.3 - Contact Metal Liftoff - File:Liftoff Results.zip
12.2 - Via 2 Litho - File:Via2Litho.zip
12.3 - Post 5 & 10 min SU8 etch - File:Post5and10minetchsu8.zip
12.. - SU8 Removal - SiNetch 2.5' + SU8 etch 3.5'+3.5' + ISO u/s 5' + Piranha 1' - File:Su8removalpostpiranhadip.zip
13.1 - SU8 Swabbed off/ PRMetal Litho - Sample 4 - File:SwabbingSU8 & ProbeMetalLitho.zip
13.4 - 2nd PRMetal Layer Lifted off - Sample 4 - File:2nd PRMetal Layer 9 5 12.zip
14.4 - Post Grating Opening Etch/Strip - Sample 4 - File:9 7postGOstrip.zip

PASSIVES RUN
Passive grating results: File:Sweeper Q2.doc
2D beam steering results, OFC video: File:OFC Doylend vid2.zip


 Jared_Misc